SUESS MICROTEC O.N. 2006
Sie werden mit Sicherheit die eigenen Prognosen toppen!
Stück Geld Kurs Brief Stück
8,05 1.500
8,03 1.500
8,02 500
8,00 2.050
7,99 2.500
7,98 500
7,83 2.000
7,82 500
7,79 2.000
7,78 1.979
Quelle: [URL]http://aktienkurs-orderbuch.finanznachrichten.de/SMH.aspx[/URL]
500 7,65
2.000 7,64
1.000 7,63
500 7,62
2.500 7,61
2.500 7,60
2.500 7,56
5.000 7,52
2.500 7,51
5.000 7,50
Summe Aktien im Kauf Verhältnis Summe Aktien im Verkauf
24.000 1:0,63 15.029
"Taiwans XinTec Orders SUSS MicroTec Lithography Solutions for Chip Scale Packaging
11:00 07.11.06
SUSS MicroTec (FWB:SMH)(GER:SMH), manufacturer of innovative lithography, wafer bonding and test equipment, announced today the completion of another equipment purchase agreement with XinTec Inc., Taiwan..."
All zu negativ wird es schon nicht werden.
Die aktuelle Bewertung läßt ja sowieso nur den Schluss zu, dass der Markt von einem
kleinen Verlust in den zweiten 6. Monaten bzw. max. einem ausgeglichenen 2. Halbjahr
ausgeht!
Bitte vergesst das IBM Potenzial nicht!
lächerlich!!
Price targets (in Eoro) Highest Consensus Median Lowest
14 11,95 12,00 6,80
__________________________________________________
Earnings Q3 FY Q3 FY FY
2005 2005 2006E 2006E 2007E
Sales*
Number
of estimates 5 5 4
Highest 37,200 157,000 166,300
Consensus 22,968 117,540 33,248 154,600 158,200
Median 32,500 154,100 159,950
Lowest 31,100 153,000 146,600
__________________________________________________
Reportet EBITA
Nuber of estimates 5 5 4
Highest 4,700 28,400 26,000
Consensus - 0,372 5,793 4,103 25,012 23,910
Median 4,105 25,000 24,520
Lowest 3,500 21,700 20,600
__________________________________________________
Reportet EBIT
Nuber of estimates 5 5 4
Highest 3,400 20,000 20,110
Consensus -2,807 -4,226 2,722 18,488 17,933
Median 2,800 18,800 19,610
Lowest 2,011 16,940 12,400
__________________________________________________
EBIT before extraordinary items
Nuber of estimates 5 5 4
Highest 3,400 20,000 20,110
Consensus -2,807 -4,226 2,722 18,488 17,933
Median 2,800 18,800 19,610
Lowest 2,011 16,940 12,400
__________________________________________________
Pre tax
Nuber of estimates 5 5 4
Highest 2,900 19,000 20,000
Consensus -3,052 -6,635 2,438 17,550 19,333
Median 2,500 17,450 19,400
Lowest 1,851 16,300 18,600
__________________________________________________
Group net income
Nuber of estimates 5 5 4
Hihest 2,520 16,000 17,000
Consensus -3,570 -8,228 2,087 14,349 13,007
Median 2,200 14,615 13,315
Lowest 1,463 12,880 8,400
__________________________________________________
EPS reported
Nuber of estimates 5 5 4
Highest 0,15 0,94 1,00
Consensus -0,23 -0,52 0,12 0,85 0,77
Median 0,13 0,87 0,80
Lowest 0,09 0,77 0,50
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Hierbei handel es sich um die vorläufigen Zahlen der Firma Suess Microtec.
Nachzulesen unter der Hompage
http://www.suss.com/main.php?rad_id=818
ich habe mir die Mühe gemacht hier alles rein zu Tippseln
war in Frankfurt für längere Zeit kein Handel möglich. Gott sei Dank.
Ich hätte damals auch 9,50 gezahlt, da ich der Meinung war hier sehen
wir in kürzester Zeit zweistellige Kurse.
Wie man sich täuschen kann! Eine Techfirma mit einem 30%igen Umsatzwachstum und
einem Halbjahres-KGV von unter 14, echt ein Witz!
von SUESS MICROTEC O.N.
aktualisieren weiter>>
Zeit Aktienkurs Stück
14:42:22 7,86 3.100
14:42:22 7,87 538
14:39:56 7,86 500
14:34:45 7,85 400
14:33:08 7,85 600
14:32:50 7,85 1.500
14:28:29 7,89 538
14:28:29 7,85 462
14:24:25 7,85 2.000
14:11:40 7,85 300
14:03:47 7,85 600
13:58:30 7,85 1.000
13:56:09 7,85 500
13:55:10 7,85 138
13:53:55 7,85 2
13:50:06 7,85 150
13:47:42 7,85 2.000
13:46:35 7,85 6.000
13:45:51 7,81 2.533
13:45:33 7,85 350
13:45:33 7,84 200
13:22:28 7,84 220
13:04:51 7,84 780
12:53:19 7,82 1.000
12:19:46 7,70 2.860
12:19:46 7,71 520
12:19:46 7,75 1.000
12:10:46 7,75 1.954
12:10:44 7,75 271
12:10:44 7,74 3.229
12:10:23 7,70 1.250
12:04:38 7,69 2.000
12:04:27 7,69 4.502
12:04:27 7,72 140
12:01:02 7,67 3.000
12:00:02 7,70 1.350
11:59:03 7,70 500
11:59:03 7,70 1.800
11:59:03 7,71 500
11:55:13 7,75 3.048
11:55:13 7,76 2.000
11:55:13 7,77 925
11:55:13 7,81 2.000
11:55:13 7,82 500
11:50:20 7,82 500
11:50:01 7,83 500
11:32:40 7,85 700
11:32:10 7,85 800
11:32:10 7,85 1.000
11:31:24 7,90 2.660
10:51:38 7,98 520
10:43:54 7,99 850
10:43:41 7,90 540
10:43:41 7,91 460
10:42:22 7,91 500
10:36:58 7,91 540
10:32:52 7,94 500
10:32:22 7,94 1.000
10:32:22 7,95 500
10:25:44 8,00 950
10:21:53 8,00 50
10:21:53 8,01 300
10:00:31 8,05 500
09:44:04 8,01 200
09:44:04 8,02 300
09:38:50 8,05 800
09:32:42 8,05 500
09:28:59 8,06 1.860
09:25:37 8,05 500
09:11:33 8,05 500
09:11:08 8,06 450
09:11:08 8,05 1.000
09:02:52 8,07 1.000
09:02:47 8,07 500
09:02:41 8,07 1.500
09:02:29 8,07 2.000
09:02:27 8,08 3.430
Man hat´s halt nochmal vor den Zahlen versucht.
Bin mir sicher, dass wir die kürzeste Zeit einstellige Kurse gesehen haben!
Freue mich auf die Zahlen!
Für alle Fälle...,
wnn ich morgen nicht arbeiten gehe, dann wisst Ihr Beschei... .-))
also ich hau mir mal ne Flasche Mineralwasser rein und jede Menge Beruhiguns-Tabletten...Grummel
das wird nen toller Abend
Was entsprechend von unguter Vorbedeutung wäre.
Es ist doch schließlich ganz normal dass eine kleine solide wenn auch leider supertolle Nebenwerte-Aktie überhaupt nicht steigt. Wollen wir die ganze lange Liste solcher Papiere aufmachen, deren KGV meinetwegen sogar noch viel niedriger ist?
(Wäre vielleicht ein willkommener Zeitvertreib, während wir aufs Christkind warten :-)
Nachzulesen unter dem Link :
http://www.ariva.de/news/article.m?id=2171940
Taiwans XinTec Orders SUSS MicroTec Lithography Solutions for Chip Scale Packaging
11:00 07.11.06
SUSS MicroTec (FWB:SMH)(GER:SMH), manufacturer of innovative lithography, wafer bonding and test equipment, announced today the completion of another equipment purchase agreement with XinTec Inc., Taiwan, a pioneering manufacturing service provider of advanced Wafer-Level Chip Size Packaging (CSP) technology and IC Packaging to the global semiconductor market. The order includes two SUSS Gamma coat/develop clusters and seven MA8 manual aligners.
XinTec will employ the systems for its CSP production that is used for the manufacture of CMOS and CCD linear and area array image sensors, light detection devices and memories.
This follow-on order, which adds to XinTecs previously installed SUSS automated production full-field exposure and coating systems shows the continued success of SUSS equipment in the fast expanding field of wafer level packaging. During the past years lithography equipment from SUSS MicroTec has demonstrated outstanding performance in the areas of wafer level packaging, says C.A Lin, VP Operation of Xintec. SUSS MicroTecs mask aligners and coaters are known for their reliability, low cost of ownership, and great flexibility in processing various substrates and resists, which provides us with the technology needed to submit the latest design in chips size packages to the industry.
SUSS Gamma systems are efficient cluster tracks capable of employing leading technology for wafer coat/bake and develop processes while maintaining all the process flexibility for which SUSS has been recognized. SUSS MA8 aligners are the leading system solution for lithography in R&D and Pre-Production on formats up to 200 mm.
We are honored that one of the leading Taiwanese chip scale packaging service providers has decided to develop its innovative packaging solutions on SUSS equipment" comments Rolf Wolf, managing director for SUSS Micro Tecs lithography division. "XinTec has selected SUSS equipment because it is capable to perfectly support the fully packaged integrated circuit by WLPCSP technology, one of the most efficient packaging process. In addition all processes, developed on the manual SUSS aligner are exactly transferable to one of our fully automated exposure systems. This capability is essential for finding commercial uses for our novel technologies."
About XinTec, Inc.:
XinTec is a pioneering company that provides advanced Wafer-Level Chip Size Packaging (CSP) technology, IC Packaging and a wide range of manufacturing services to the global semiconductor market. The company is headquartered in Chung-Li Industrial Park, Taiwan. XinTec Wafer Level CSP is a mainstream wafer level packaging technique, offering key advantages over conventional chip packages such as miniaturized and reliable design, increased functionality and board capacity, lower cost and enhanced quality for applications in cellular phones, PDAs, still cameras and other electronic devices. In response to strong market demand, XinTec is rapidly expanding its production capacity. For more information, please visit http://www.xintec.com.tw.
About SUSS MicroTec
SUSS MicroTec is a leading supplier of production, process and test technology for the semiconductor industry. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, substrate bonders, flip-chip bonders and probe systems. Headquartered in Munich, Germany, SUSS has 5 international manufacturing sites and provides support from sales and service centers in North America, Europe, Asia and Japan. For more information, please visit http://www.suss.com
All statements in this release other than historical facts are forward-looking statements within the meaning of U.S. Private Securities Litigation Reform Act of 1995. Words such as "believe", "expect", "intend", "anticipate", "estimate", "should", "may", "will", "plan" and similar words and terms used in relation to the enterprise are meant to indicate forward-looking statements of this kind. The company accepts no obligation toward the general public to update or correct forward-looking statements. All forward-looking statements are subject to various risks and uncertainties, as a result of which actual events may diverge numerically from expectations. The forward-looking statements reflect the view at the time they were made.