Aixtron purpose of this thread
mit sicherheit relevant für SIC und somit auch für Aixtron. Viele Grüße, Fel
WASHINGTON, Aug 9 (Reuters) - A group of 28 U.S. House Democrats on Monday asked congressional leaders to back $85 billion in funding for electric vehicle charging infrastructure, a big jump over funding proposed in a bill before Congress.
The current $1 trillion bipartisan infrastructure bill under consideration has $7.5 billion in EV charging infrastructure funding, but Democrats plan to add additional funding in a separate measure that could spend up to $3.5 trillion.
The lawmakers, led by Representatives Debbie Dingell and Yvette Clarke, said in a letter that higher funding will "help add utility electrical capacity to enable robust charging, increasing the supply of renewable energy, and build grid resilience in the face of climate change."
https://www.reuters.com/world/us/...nfrastructure-funding-2021-08-09/
Ich (und auch Baggo- davon gehe ich aus) vermissen dich jedenfalls.
:-)
"This range includes the company’s expected investment of up to $20M in the quarter ended September 30, 2021 for compound semiconductor expansion, the majority of which is for SiC expansion."
https://finance.yahoo.com/news/...rated-reports-fiscal-105500139.html
fyi some transcript excerpts on SiC & 3D Sensing. Cree published quarterly results last night, shares down some 6% in after hours trading.
II-VI statements
On SiC:
“We are excited to announce the acceleration of our investments to scale the manufacturing of our silicon carbide substrates, devices and modules to enable the acceleration of the electrification of the global transportation infrastructure. In fiscal year 2022, we plan to increase our investments to about $200 million in R&D and capital, to continue to lay the foundation on which to grow the business to the next level. Our silicon carbide business, which today is less than 5% of our revenue is targeted to become one of the largest businesses in our company inside 10-years. We believe that our investments and opportunities, combined with our ability to execute, will allow us to become well positioned in this large market with attractive growth dynamics. Accordingly, we are planning incremental R&D investments of about 2% to 3% of revenue for the next few years. We anticipate investing around $1 billion over the next decade as generation 3 semiconductors fabricated from wide-band gap materials including the silicon carbide grow to underpin a number of important industry transformations and are planning to establish a leadership position long-term.
(…)
In the meanwhile, we will be making a even larger investment than what we have been planning to get the silicon carbide substrate capacity in place for what we need and for also what the market needs as well, okay.”
On 3D sensing:
“3D Sensing posted the highest annual growth, more than doubling to just under 10% of sales, which allowed us to achieve our market penetration and share gain about one-year ahead of plan.
This journey will continue as we accelerate our innovation road map, including multi-junction VCSELs, photodiodes, metal lenses and driver electronics and delivering new module functionalities to wafer-scale co-packaging.
These modules will provide a compelling value proposition in multiple end markets, including in automotive, where driver and occupancy monitoring systems are increasingly recommended or acquired by U.S. and European transportation safety regulators.”
https://seekingalpha.com/article/...-results-earnings-call-transcript
Cree on SiC:
“We went from moving dirt to installing equipment in the clean room of the world's largest silicon carbide fab in upstate New York which will begin processing 200 millimeter wafers in the first half of calendar 2022.”
“We are at the beginning of a multi-decade secular shift to silicon carbide and we now believe the demand curve is steeper for devices than we originally expected further bolstering our confidence in our long-term outlook. The investments we are making today will position us well to capitalize on the tremendous opportunities ahead and firmly establish our industry leadership position.”
“A key element to support the increased adoption of Silicon Carbide in the automotive sector and across several other industries is the expansion of manufacturing capacity. Our Mohawk Valley 200-millimeter fab is on track to begin device qualification production runs in the first half of calendar 2022. The facility is shaping up nicely and has shown very well during recent customer visits to the fab. On our campus here in Durham, we expanded our materials operations to a second building on our Durham campus, which is part of the previously announced plan to increase materials capacity by 30x.”
“I was actually very impressed to see how many people are talking about silicon carbide and how positive comments are. And I had in mind SD Micro reiterating that they want to increase the front end I mean front-end capacity by 10X between 2017 and 2024. I think the Infineon was not that specific but [indiscernible] talked about spending $1 billion in CapEx on Silicon Carbide over a decade. [indiscernible] is talking about growing capacity 5x between 2020 and 2025”.
“First off, the demand is definitely there and it -- and the appetite for silicon carbide just continues to grow. Neil and I were just in Europe a month ago or so for a couple of weeks visiting with OEMs and with Tier 1s and so forth and all of the indications we got from pretty much all the customers we saw is what they thought was going to be the demand. It's now higher than what they originally thought and faster than they originally thought across multiple different end equipments and certainly automotive being a pretty key part of that.”
“As we discussed in the prepared remarks, the slope of the demand curve for silicon carbide solutions particularly on devices has dramatically increased and is ahead of what we previously thought.We thought the inflection point, as we talk about Investor Day and since then was kind of 2023, kind of 2024 timeframe. And right now, we're seeing that pulling all the way into fiscal 2022.”
“So, I think what'll happen here and if you take a step back, in Durham alone, we put in over a 100 tools in the last year to support higher demand. And we just need to get that, improve that factory output and kind of support that kind of demand curve. And as Greg mentioned earlier, we've got a new leadership to get better focus on that and really improve the North Carolina footprint.”
https://seekingalpha.com/article/...-results-earnings-call-transcript
Ist sehr gut gemacht und beschreibt perfekt die Möglichkeiten des Unternehmens.
Jetzt gehts auf die 25 und dann weiter Richtung Norden.
:-)
"So, I think what'll happen here and if you take a step back, in Durham alone, we put in over a 100 tools in the last year to support higher demand"
richtig interpretiere. Es war unser Verständnis here, dass Cree definitiv SiC Kunde bei Aix ist. Aber 100 Tools hat Aix sicher nicht an Cree geliefert. Wenn es denn um SiC Tools handelt.
Wie ist deine Interpretation?
Besten Dank fürs Teilen der Transkripte!!
Interesting news in the SIC space overnight with On Semi acquiring GTAT for 415m $.
Not sure if GTAT generates significant sales at this moment so the valuation is arguably high. Shows that industry players focus more on more on SIC while I remember that 2 years ago Sic and it’s future was still strongly debated.
https://s27.q4cdn.com/926862268/files/...2021/Terra-IR-Deck-FINAL.pdf
Positive for SIC sentiment and thus Aixtron and PVA!
Regards,
Fel
Das behauptet der Aktionär.
https://www.deraktionaer.de/artikel/aktien/...0236418.html?feed=ariva
Hat jemand etwas woanders gelesen?
Ich halte nicht viel vom Aktionär und auch von Gerüchten. Dennoch bin ich neugirieg, ob der Aktionär einfach so Schmarrn schreibt nur um dem Artikel mehr Gewicht zu verleihen. Das würde mich nicht allzuviel wundern.
The underlying business remains very strong in my opinion and 2022 shapes up to be a decent year as well. So with good Q3/Q4 ahead I think the stock may continue to move higher if you have some patience.
Regards,
Fel
a very interesting Bloomberg Article on Chinese companies continuing their massive spending plans on gaining Chip Independence from the USA - a theme I have flagged over 1 year ago and that I think is in full swing with Aixtron and PVA Tepla being major beneficiaries as they deliver crucial technology.
@CWL: Do you know SMIC? Anything to add wrt to Aixtron? Do they need Aixtron tools or is ASML etc more in focus?
Regards!
Fel
By Bloomberg News
(Bloomberg) -- Semiconductor Manufacturing International
Corp. aims to spend $8.87 billion building a new plant on the
outskirts of Shanghai, a major expansion in capacity at a time
China’s trying to build a world-class chip industry.
SMIC has signed an agreement to establish a 100,000 per-
month wafer plant in the Lin-Gang Special Area, a free trade
zone run by the city. The facility will focus on more mature
technology of 28 nanometers or older, the company said in a
filing. It plans to set up a joint venture with registered
capital of $5.5 billion with Shanghai’s government to oversee
the project, of which the company will own at least 51%. SMIC’s
shares jumped as much as 2.7% in Hong Kong and 4.8% in Shanghai.
The envisioned plant comes on top of a $2.35 billion
factory SMIC’s planning for south China’s Shenzhen that will be
able to make as many as 40,000 12-inch wafers per month.
Together, the projects represent an effort to shore up its lead
in domestic chipmaking while furthering the country’s broader
chip ambitions. The Shanghai facility’s mature-node chips could
be targeted at the auto-making industry, which is struggling
with an endemic shortage of the semiconductors they need to
power electric vehicles and in-car systems.
Shanghai-based SMIC is China’s best hope for gaining clout
in advanced chips used in devices from smartphones to base
stations. Its capacity and technical know-how are crucial to
helping Beijing overcome a U.S.-led effort to curb its tech
ambitions. But the company has been unable to get key machinery
to keep advancing its technology, after the U.S. placed it under
sanctions last year on national security grounds.
Read more: Xi Taps Top Deputy to Lead China’s Chip Battle
Against U.S.
Beijing is moving swiftly to cut a dependence on the West
for crucial components like chips, an issue that became more
urgent after a global shortage of semiconductors worsened during
the pandemic.
Chinese President Xi Jinping has tapped close confidante
Liu He, the economic czar whose sprawling portfolio spans trade
to finance and technology, to spearhead the development of so-
called third-generation or compound semiconductor chip
development. He’s now leading the formulation of a series of
financial and policy support for the technology, Bloomberg News
has reported.
SMIC’s newest plant will be built in a free-trade zone in
the southeastern suburbs of Shanghai, an enlargement of the
tariff-free areas Xi originally approved to attract foreign
investment and trade. The company is expanding because its
existing plants are running at or close to full capacity and its
executives are counting on being able to procure equipment to
make chips based on more mature technologies, despite U.S.
sanctions.
just a quick (and sad) info that Baggo MH asked me to place in the forum here:
He is currently blocked from the Forum and can thus no longer participate here at the moment.
No idea why, but that explains why he is not active at the moment. I hope he can solve the issue in the short-term.
Cheers,
Fel
Irgendwie scheint hier einiges im Argen zu liegen.
Ich selbst habe nichts veranlasst und Ariva meldet sich auch nicht mehr zu diesem Problem. Zuletzt vor einer Woche - man hat mich nciht vergessen und arbeitet an dem Problem.
Gruß
baggo-mh
https://www.automotiveworld.com/news-releases/...velopment-of-e-cars/
https://www.bosch-semiconductors.com/events/iaa-2021.html
Maybe others like @Baggo, DLG or CWL can add more expertise?
NEW APPLIED MATERIALS TECHNOLOGIES HELP LEADING SILICON CARBIDE CHIPMAKERS ACCELERATE THE TRANSITION TO 200MM WAFERS AND INCREASE CHIP PERFORMANCE AND POWER EFFICIENCY
Key to the world’s best electric vehicle power trains, silicon carbide chips are transitioning to larger, 200mm wafers which boost output to meet growing global demand
Applied’s new 200mm CMP system precisely removes silicon carbide material from wafers to help maximize chip performance, reliability and yield
Applied’s new “hot implant” technology for silicon carbide chips injects ions with minimum damage to crystalline structures, thereby maximizing power generation and device yield
https://ir.appliedmaterials.com/news-releases/...ding-silicon-carbide
The projected total number of 2025 EV's is 20 million. If we assume a G5 WW produces 16 six inch epi wafers per day, by then the industry would need about 600 G5-equivalent tools to meet that demand.
This is only for SiC chips on cars. It does no include SiC for all other applications.
excellent research once again, thank you!
Have you got any idea about the timeline behind their decisions? Do I understand correctly that so far they are not active in SIC? If they are not, it would mean that they have to decide for Aixtron or Tokyo Electron equipment (or maybe both to run dual sourcing).
Given Chinas progress in EV's one should really expect them to place first orders relatively soon in order to follow the market quickly, dont you think?
Would be interesting to read and discuss more about Foxconn.
All the best!
Fel
as I was watching from outside I discovered that this thread can be viewed and accessed from outside.
Best regards
baggo-mh
ich habe am 14.09. am o.g. Event teilgenommen und folgende Notizen für mich gemacht.
Der Einfachheit halber stelle ich einfach mein Word Dokument hier ein.
12 Teilnehmer – davon 2 mal AlsterResearch
1 Aixtron IR zu zweit
Dauer 80 Minuten
Halbleiter (Silizium, TSMC, Intel, Speicherchips) sind nicht das Gleiche wie Verbindungshalbleiter die aus versch. Materialien der Periodenklassen III und V zusammengesetzt werden. Aixtron stellt Maschinen zur Herstellung von Verbindungshalbleitern her.
Financials
Oliver Wojahn covered die Aktie seit August 2001.
Damals buy Ziel € 31 – heute buy Ziel € 29 ohne MicroLED opportunity eingepreist zu haben.
Credit rating: A up from BBB
current cash position invested in very conservative Fonds
Happy with order guidance range of 440-480 (last update was for a range of 420 to 460 maybe GP mistakenly mentioned the increased figures already) Es gibt noch einiges zu tun, aber wir sind happy mit der Guidance
ESG Funds are increasingly interested in investing
LED
Hydroculture (Licht und water purification)
ROY für Mini Displays
Micro LED - Alle Farben – RGB auch blau
-§Hat noch keine große Effekte aber wenn es kommt, dann kommt es
-§Wirft langsam seine Schatten voraus.
-§Industrie geht langsam davon aus, dass das kommen wird - Apple watch maybe 2023
-§Challenges:
o§Fehlerfreie wafer (Vorteil Aixtron) und
o§Transfer Technologie im nachgelagerten Elektrifikations-Prozess
Laser
3D- Sensing - Apple Face ID Handy introduction führte zu einem Oversupply im Markt. Wird jetzt langsam verdaut.
Next Application: Handy world side
In allen Glasfaserkabeln zur optischen Datenübertragung stecken die Produkte die auf Aixtron
Maschinen hergestellt wurden.
Leistungselektronik
GaN bis 600 Volt und SiC > 600 Volt sind die beiden Technologien an Start
GaN und 5G
Auf Aixtron Maschinen hergestellte GaN Chips findet man
-§Schnelladen in Handy-chargern: Infineon, TMSC, wurden genannt
-§Server Farmen bis 600 Volt
-§Auf allen 5G Sendemasten
80% Marktanteil und neue Tools in der Entwicklung (Vollautomatisiert)
Nächste Anwendungen: Haushaltsgeräte ?? Derzeit 6 Silizium Chips 2 pro Phase könnten durch einen GaN Chip ersetzt werden.
GaAS chips
3G, 4G Empfangs-Chips in Handys von Aixtron Maschinen
5G Empfangschips noch nicht da noch nicht die gesamte Bandbreite des 5G Übertragungsspektrums genutzt wird.
SIC
Jahresvolume 30-50 Anlagen/Jahr für die nächsten 5 Jahre
Preise 3; 3,5; bis 4 Millionen Euro je nach Ausstattung
Die Technik wird immer dort genutzt wo Ströme oder hohe Wattzahlen anfallen. Derzeit ist der main inverter in electric vehicles (EV) Silizium basiert. In Zukunft wird das SiC sein weil das Strom und platzsparender ist.
Market Leader ist Tokyo Elektron. Kleinere Mitbewerber LPE Italien und ein weiters Unternehmen
Es gibt 5 große Kunden:
- Cree
- Infineon §
-§ST Micro
-§ON Semi
- Rohm§
Einer ist ein jahrelanger treuer Aixtron Bestandskunde (Cree wurde nicht genannt) und man hat Epiworld (CN) und Bosch als Neukunden gewinnen können.
Jetzt arbeitet man daran Tokyo Elektron die Marktanteile abzujagen durch
-§lower cost of ownership
-§fully automated
-§upgrade Möglichkeit from 6 to 8‘
Man muss den nächsten Capex Cycle der Kunden für die Umstellung erwischen um die neue Aufträge zu erhalten.
Gruß
baggo-mh
There are a lot of SiC activities. It takes a long time for auto qualification. Therefore the initial epi tools have to be installed at the IDM's and/or their epi suppliers very soon to meet their qualification timelines to the auto makers which are pushing out EV's ASAP. For Aixtron it has to get the G5 WW C in now for the qualification phase.
https://www.aixtron.com/en/investors/...de%20Production%20System_n338
Showa Denko just signed long-term contracts with Rohm and Infineon to provide SiC epi wafers this year:
https://www.sdk.co.jp/english/news/2021/41372.html
https://www.sdk.co.jp/english/news/2021/39938.html
Rohm and Infineon are IDM's (Integrated Device Manufacturer) and have their own SiC epi wafer capability. However, they also rely on outside SiC epi wafers providers like Showa Denko, CREE, etc.
Showa Denko raised about $50m in August issuing stocks to expand its SiC related capacity.